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Grinding Wheel For Semiconductor And Photoelectricity

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Xinzheng Dia Abrasives Co.,Ltd

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Grinding Wheel For Semiconductor And Photoelectricity

MOQ : 1PC

Price : Negotiable

Payment Terms : T/T

Supply Ability : 20000 pcs per month capacity

Delivery Time : 10-14 days delivery time

Packaging Details : Box

Place of Origin : China

Certification : High QC standard, 100% inspection

Key word : Centerless Grinding Wheel

Feature : High efficiency grinding

Common Shape : 1A1

Wheel Size : Resin Maximum OD is 750mm Vitrified OD:300mm~500mm

Application : Semiconductor and Photovoltaic industries

Grit size : Resin bond the finest grit size is 3000

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Resin Vitrified Bond Centerless Grinding Wheel Good Sharpness With High Performance

Centerless Grinding Wheels are made of grains of aluminum oxide and silicon carbide abrasive material, bonded together with vitrified, resin or rubber. Centerless Grinding Wheels are used on a wide variety of workpieces. They produce extremely close tolerances on metal cylindrical forms or parts.

Centreless grinding wheel is used for grinding cylindrical part out surface, supported without centres on a stationary work rest blade and moving between the grinding wheel and the regulating wheel.

Features:

Resin:
High efficiency grinding in one batch, good sharpness, long using life
Vitrified:
high efficiency and good shape retention

Specification:

Common Shape	Wheel Size	Grit Size	Classic Specification
1A1	Resin Maximum OD is 750mm Vitrified OD:300mm~500mm	Resin the finest grit size is 3000

Application

Industry	Workpiece&Material	Machine	Bond	Working Data
Semiconductor and Photovoltaic industries	Ceramic, magnet, sapphire		Resin Vitrified

For any inquire, quality feedback or technical question, there always be a professional responding answered by our technician team within 24 hours.

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Grinding Wheel For Semiconductor And Photoelectricity

Grinding Wheel For Semiconductor And Photoelectricity

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